Three Dimensional System Integration: IC Stacking Process and Design |  | Creators: Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic
Publisher: Springer
Category: Book
List Price: $129.00
Buy New: $110.51
as of 9/9/2010 06:14 CDT details
You Save: $18.49 (14%)
Seller: Amazon.com
Sales Rank: 5,119,949
Media: Hardcover
Edition: 1st Edition.
Pages: 233
Number Of Items: 1
ISBN: 1441909613
Dewey Decimal Number: 004
EAN: 9781441909619
ASIN: 1441909613
Publication Date: November 1, 2010 (In 53 Days)
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Availability: Not yet published
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Product Description
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
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